Browsing by Author "M. I. M. Ghazali,"
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Publication 3-D Printed Embedded Passive Harmonic Sensor Tag as Markers for Buried Assets Localization(IEEE, 2019) ;M. I. M. Ghazali, ;S. KaruppuswamiP. ChahalIn this article, a fully 3-D printed embedded passive harmonic sensor tag with improved read range and better clutter rejection is presented for detecting assets located underground. The sensor tag receives the query signal from a 3-D printed Vivaldi antenna at the fundamental frequency (f 0 ) and radiates back to the interrogator at the second harmonic frequency (2f 0 ). The sensor tag consists of a linearly polarized double slot antenna that operates at both the fundamental as well as the second harmonic frequency. Utilizing the capabilities of 3-D printing, a nonlinear diode is embedded onto the substrate and coupled to the antenna for generating the higher order harmonics is designed. The 3-D printed tag is compatible with direct printing onto the buried assets, such as plastic pipelines, as markers for localization. The polarization of the antenna is used for identifying the location and the direction of the pipeline. The sensor tag has higher signal-to-noise ratio and can be readily interrogated with any hand-held readers from above the ground.1 - Some of the metrics are blocked by yourconsent settings
Publication Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization(IEEE (Institute of Electrical and Electronics Engineers Inc.), 2017) ;J. A. Byford, ;M. I. M. Ghazali, ;S. Karuppuswami, ;B. L. WrightP. ChahaThe ultimate goal of this paper is to print radio frequency (RF) and microwave structures using a 3-D platform and to pattern metal films on nonplanar structures. To overcome substrate losses, air core substrates that can readily be printed are utilized. To meet the challenge of patterning conductive layers on complex or nonplanar printed structures, two novel self-aligning patterning processes are demonstrated. One is a simple damascene-like process, and the other is a lift-off process using a 3-D printed lift-off mask layer. A range of microwave and RF circuits are designed and demonstrated between 1 and 8 GHz utilizing these processes. Designs are created and simulated using Keysight Advanced Design System and ANSYS High Frequency Structure Simulator. Circuit designs include a simple microstrip transmission line (T-line), coupled-line bandpass filter, circular ring resonator, T-line resonator, resonant cavity structure, and patch antenna. A commercially available 3-D printer and metal sputtering system are used to realize the designs. Both simulated and measured results of these structures are presented.1