Publication:
3D printed substrates for the design of compact RF systems

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dc.Conferencecode151263
dc.Conferencedate28 May 2019 through 31 May 2019
dc.Conferencename69th IEEE Electronic Components and Technology Conference, ECTC 2019
dc.contributor.affiliationsFaculty of Engineering and Built Environment
dc.contributor.affiliationsUniversiti Sains Islam Malaysia (USIM)
dc.contributor.affiliationsMichigan State University
dc.contributor.authorMohd Ghazali M.I.en_US
dc.contributor.authorMondal S.en_US
dc.contributor.authorKaruppuswami S.en_US
dc.contributor.authorChahal P.en_US
dc.date.accessioned2024-05-28T08:26:37Z
dc.date.available2024-05-28T08:26:37Z
dc.date.issued2019
dc.description.abstractIn this paper, Additive Manufacturing (AM) using 3D printing has been shown as a potential candidate for realizing customized compact solutions for RF packaging applications. Cost effective 3D printing based packaging solutions with customized substrates and air gaps allow easier integration of multiple RF components with lower substrate losses. Using a damascene-like conductor patterning process and a LEGO-like assembly process, an amplifier coupled to an air-substrate based patch antenna is demonstrated in a single integrated package. The antenna overlays the amplifier circuit leading to a compact design. The proposed customization of substrates and 3D printing strategies can be extended to multiple-system level stacking for SOP/SIP packaging customized for applications such as 5G. � 2019 IEEE.
dc.description.natureFinalen_US
dc.description.sponsorshipIEEE Electronic Packaging Society (EPS)
dc.identifier.ArtNo8811010
dc.identifier.CODENPECCA
dc.identifier.doi10.1109/ECTC.2019.00025
dc.identifier.epage118
dc.identifier.isbn9781730000000
dc.identifier.issn5695503
dc.identifier.scopus2-s2.0-85072283452
dc.identifier.spage113
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85072283452&doi=10.1109%2fECTC.2019.00025&partnerID=40&md5=bb913ced51a31778a9272ee917d8dc8f
dc.identifier.urihttps://oarep.usim.edu.my/handle/123456789/8744
dc.identifier.volume2019-May
dc.languageEnglish
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.relation.ispartofProceedings - Electronic Components and Technology Conference
dc.sourceScopus
dc.subject3D printingen_US
dc.subject5Gen_US
dc.subjectCompact systemsen_US
dc.subjectElectronics packagingen_US
dc.subjectChip scale packagesen_US
dc.subjectCost effectivenessen_US
dc.subjectElectronics packagingen_US
dc.subjectMicrostrip antennasen_US
dc.subjectNetwork componentsen_US
dc.subjectSlot antennasen_US
dc.subjectSubstratesen_US
dc.subject3-D printingen_US
dc.subjectAmplifier circuitsen_US
dc.subjectCompact systemen_US
dc.subjectIntegrated packagesen_US
dc.subjectLEGO-like assemblyen_US
dc.subjectPackaging solutionsen_US
dc.subjectPatterning processen_US
dc.subjectPrinted substrateen_US
dc.subject3D printersen_US
dc.title3D printed substrates for the design of compact RF systems
dc.typeConference Paperen_US
dspace.entity.typePublication

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