Publication:
3D printed interposer layer for high density packaging of IoT devices

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dc.Conferencecode151263
dc.Conferencedate28 May 2019 through 31 May 2019
dc.Conferencename69th IEEE Electronic Components and Technology Conference, ECTC 2019
dc.FundingDetailsACKNOWLEDGMENT This work was supported by the Axia Institute. The authors would like to thank Mr. Brian Wright from MSU ECEshop for his help with 3D printing and all members of MSU EMRG group for their helpful suggestions.
dc.contributor.affiliationsFaculty of Engineering and Built Environment
dc.contributor.affiliationsMichigan Sate University
dc.contributor.affiliationsUniversiti Sains Islam Malaysia (USIM)
dc.contributor.authorMondal S.en_US
dc.contributor.authorMohd Ghazali M.I.en_US
dc.contributor.authorWijewardena K.en_US
dc.contributor.authorKumar D.en_US
dc.contributor.authorChahal P.en_US
dc.date.accessioned2024-05-28T08:26:41Z
dc.date.available2024-05-28T08:26:41Z
dc.date.issued2019
dc.description.abstract3D printing has emerged as a potential solution to fabricate different RF components and embed prepackaged devices. In this work, 3D printed interposer layer is proposed to enable vertical stacking of different heterogeneous components and substrates. Different design parameters were first simulated using HFSS to optimize for maximum possible bandwidth. After optimization, the design parameters were used to fabricate a wireless battery less digital modulator as an example IoT device. Measurement results are provided to validate the design and simulation results. � 2019 IEEE.
dc.description.natureFinalen_US
dc.description.sponsorshipIEEE Electronic Packaging Society (EPS)
dc.identifier.ArtNo8811138
dc.identifier.CODENPECCA
dc.identifier.doi10.1109/ECTC.2019.00273
dc.identifier.epage1692
dc.identifier.isbn9781730000000
dc.identifier.issn5695503
dc.identifier.scopus2-s2.0-85072268235
dc.identifier.spage1687
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85072268235&doi=10.1109%2fECTC.2019.00273&partnerID=40&md5=8eda8b25f422ec5cfe8e60bad6171304
dc.identifier.urihttps://oarep.usim.edu.my/handle/123456789/8749
dc.identifier.volume2019-May
dc.languageEnglish
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.relation.ispartofProceedings - Electronic Components and Technology Conference
dc.sourceScopus
dc.subject3D printingen_US
dc.subjectEnergy harvestingen_US
dc.subjectInterposeren_US
dc.subjectPassiveen_US
dc.subjectWirelessen_US
dc.subjectEnergy harvestingen_US
dc.subjectInternet of thingsen_US
dc.subjectNetwork componentsen_US
dc.subjectRadioen_US
dc.subject3-D printingen_US
dc.subjectDesign and simulationen_US
dc.subjectDigital modulatorsen_US
dc.subjectHeterogeneous componenten_US
dc.subjectHigh-density packagingen_US
dc.subjectInterposeren_US
dc.subjectPassiveen_US
dc.subjectVertical stackingen_US
dc.subject3D printersen_US
dc.title3D printed interposer layer for high density packaging of IoT devices
dc.typeConference Paperen_US
dspace.entity.typePublication

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