Publication: 3-D Printed Air Substrates for the Design and Fabrication of RF Components
| dc.contributor.author | Mohd Ifwat Mohd Ghazali , | en_US |
| dc.contributor.author | Saranraj Karuppuswami , | en_US |
| dc.contributor.author | Amanpreet Kaur , | en_US |
| dc.contributor.author | Premjeet Chahal | en_US |
| dc.date.accessioned | 2024-05-28T04:22:50Z | |
| dc.date.available | 2024-05-28T04:22:50Z | |
| dc.date.issued | 2017 | |
| dc.description.abstract | This paper presents the fabrication and characterization of radio frequency (RF) and microwave passive structures on an air substrate using additive manufacturing (3-D printing). The air substrate is realized by 3-D printing RF structures in two separate pieces and snapped together face to face using a LEGO-like process. Spacers printed on the periphery provide the desired air substrate thickness. Metal patterning on nonplanar printed plastic structures is carried out using a damascene-like process. Various RF structures such as low dispersion transmission line, T-line resonator, high-gain patch antenna, slot antenna, and cavity resonator are demonstrated using this process. Good performance is achieved; for example, measured 50-Ω transmission line shows low loss of 0.17 dB/cm at 4 GHz, and a patch antenna (center frequency of 4.5 GHz) shows gain and bandwidth of 7.6 dB and 0.2 GHz, respectively. Details of both measured and simulation results are presented. | en_US |
| dc.identifier.citation | M. I. M. Ghazali, S. Karuppuswami, A. Kaur and P. Chahal, "3-D Printed Air Substrates for the Design and Fabrication of RF Components," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 6, pp. 982-989, June 2017, doi: 10.1109/TCPMT.2017.2686706. | en_US |
| dc.identifier.doi | https://doi.org/10.1109/TCPMT.2017.2686706 | |
| dc.identifier.epage | 989 | |
| dc.identifier.issn | 2156-3950 | |
| dc.identifier.issue | 6 | |
| dc.identifier.other | 2345-7 | |
| dc.identifier.spage | 982 | |
| dc.identifier.uri | https://ieeexplore.ieee.org/document/7898849 | |
| dc.identifier.uri | https://oarep.usim.edu.my/handle/123456789/5450 | |
| dc.identifier.volume | 7 | |
| dc.language.iso | en | en_US |
| dc.publisher | IEEE (Institute of Electrical and Electronics Engineers Inc.) | en_US |
| dc.relation.ispartof | IEEE Transactions on Components Packaging and Manufacturing Technology | en_US |
| dc.title | 3-D Printed Air Substrates for the Design and Fabrication of RF Components | en_US |
| dc.type | Article | en_US |
| dspace.entity.type | Publication |