Publication: 3D printed interposer layer for high density packaging of IoT devices
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Date
2019
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers Inc.
Abstract
3D printing has emerged as a potential solution to fabricate different RF components and embed prepackaged devices. In this work, 3D printed interposer layer is proposed to enable vertical stacking of different heterogeneous components and substrates. Different design parameters were first simulated using HFSS to optimize for maximum possible bandwidth. After optimization, the design parameters were used to fabricate a wireless battery less digital modulator as an example IoT device. Measurement results are provided to validate the design and simulation results. � 2019 IEEE.
Description
Keywords
3D printing, Energy harvesting, Interposer, Passive, Wireless, Energy harvesting, Internet of things, Network components, Radio, 3-D printing, Design and simulation, Digital modulators, Heterogeneous component, High-density packaging, Interposer, Passive, Vertical stacking, 3D printers